This is the Booking and Request system for the equipment in the clean room of the MML 1. If you have any doubt on how it works please consult the help.

A quick summary of the booking and request rules (only the most often abused part are here, please, refer to the complete clean-room regulation.)
- request can be made to ask a technician to perform a process for you if you are not authorised to use the machine. Select the process and then enter the thickness you need in the required unit and the number of wafer to process. To decrease the fee we will charge you, use the empty space in existing request - the run costs will be spread over all the users/wafers!
- booking machine before using is compulsory for all users (the booking list is used to generate statistics on machine's use, schedule maintenance and charge users). Please don't forget or your membership will be revoked...

Request:

  • + CMP Logitech (Max wafer capacity) - PEK Soo Siong
    • CMP metal (1): nm on wafer
    • CMP oxide (1): nm on wafer
    • CMP polymer (1): nm on wafer
    • CMP silicon (1): nm on wafer
  • + Ellipsometer (Max wafer capacity) - HO Kar Kiat
    • Oxide / Nitride (1): 1 on wafer
  • + Furnace - Annealing (Max wafer capacity) - Nordin Bin Abdul Kassim
    • Annealing (25): h on wafers
    • Boron Diffusion (8): h on wafers
    • Diffusion Drive In (25): h on wafers
    • Phosphorus Diffusion (4): h on wafers
  • + Furnace - Oxidation (Max wafer capacity) - Nordin Bin Abdul Kassim
    • Oxidation (25): nm on wafers
    • Oxidation Dry (25): nm on wafers
    • Oxidation Wet (25): nm on wafers
    1000 nm of Oxidation
    (3 days old)    		8(PUSHPAPRAJ Singh)1234567891011121314151617Process run on 23/11/09
    1000 nm of Oxidation
    (5 days old)    		10(SUN Gengzhi)123456789101112131415Process run on 23/11/09
  • + RIE (Technics) (Max wafer capacity) - HO Kar Kiat
    • RIE CF4 (1): um on wafer
    • RIE O2 (1): um on wafer
  • + RIE Deep (STS) is under maintenance. New request will resume on the 24/11/2009 - HOONG Sin Poh
    600 µm of RIE Deep Si
    (4 days old)    		1(HE Jinhua)
    300 µm of RIE Deep Si
    (4 days old)    		1(HE Jinhua)
    400 µm of RIE Deep Si
    (5 days old)    		1(SHEN Zhiyuan)
    400 µm of RIE Deep Si
    (5 days old)    		1(SHEN Zhiyuan)
    300 µm of RIE Deep Si
    (6 days old)    		1(MOHAMMAD Olfatnia)Process run on 24/11/09
    500 µm of RIE Deep Si
    (6 days old)    		1(MOHAMMAD Olfatnia)Process run on 24/11/09
    300 µm of RIE Deep Si
    (11 days old)    		1(HE Jinhua)
  • + Sputter Magnetron (Max wafer capacity) - PEK Soo Siong
    • Cryo pump re-generation (0): nm on wafer
    • Sputter Ag (4): nm on wafers
    • Sputter Al (4): nm on wafers
    • Sputter Au (4): nm on wafers
    • Sputter Cr (4): nm on wafers
    • Sputter Cr/Au (4): nm on wafers
    • Sputter Cu (4): nm on wafers
    • Sputter Mo (4): nm on wafers
    • Sputter NiTi (4): nm on wafers
    • Sputter Ta (4): nm on wafers
    • Sputter Ti (4): nm on wafers
    • Sputter Ti/Au (4): nm on wafers
    • Sputter Ti/Cu (4): nm on wafers
    • Sputter W (4): nm on wafers
    600 nm of Sputter Cu
    (5 days old)    		2(LU Jingyu)12
    600 nm of Sputter Ti
    (5 days old)    		2(LU Jingyu)12
    20 nm of Sputter Cr
    (5 days old)    		2(LU Jingyu)12
    300 nm of Sputter Au
    (5 days old)    		4(SHEN Zhiyuan)
  • + Wafer bonder (Max wafer capacity) - HO Kar Kiat
    • Wafer Bonding Anodic Si/Glass (1): pc on wafer
    • Wafer Bonding Fusion Si/Si (1): pc on wafer
    • Wafer Bonding Polymer (Polymer not provided) (1): pc on wafer
    1 pc of Wafer Bonding Fusion Si/Si
    (6 days old)    		1(MOHAMMAD Olfatnia)Process run on 23/11/09
Legend: Normal hoursAfter hourMachine freeMachine booked

Booking:

Person in charge Book
Machine		 Monday, 23 November 2009 Tuesday, 24 November 2009 Book
Machine		 Wednesday, 25 November 2009 Thursday, 26 November 2009 Book
Machine		 Friday, 27 November 2009 Saturday, 28 November 2009 Book
Machine		 Sunday, 29 November 2009 Monday, 30 November 2009
09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20
PEK Soo Siong CMP Logitech CMP Logitech CMP Logitech CMP Logitech
PEK Soo Siong Electroplating (Copper) Electroplating (Copper) Electroplating (Copper) Electroplating (Copper)
HO Kar Kiat Ellipsometer Ellipsometer Ellipsometer Ellipsometer
Nordin Bin Abdul Kassim Furnace - Annealing Furnace - Annealing Furnace - Annealing Furnace - Annealing
Nordin Bin Abdul Kassim Furnace - Oxidation
Nordin
Bin Abdul Kassim 		forSUN
Gengzhi(10)
Nordin
Bin Abdul Kassim 		forPUSHPAPRAJ
Singh(8)
 Furnace - Oxidation Furnace - Oxidation Furnace - Oxidation
Person in charge Book
Machine		 Monday, 23 November 2009 Tuesday, 24 November 2009 Book
Machine		 Wednesday, 25 November 2009 Thursday, 26 November 2009 Book
Machine		 Friday, 27 November 2009 Saturday, 28 November 2009 Book
Machine		 Sunday, 29 November 2009 Monday, 30 November 2009
09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20
HO Kar Kiat Mask aligner (Karl Suss)
SHEN
Zhiyuan
KERAMATI
Hamed
HE
Jinhua
MOHAMMAD
Olfatnia
MOHAMMAD
Olfatnia
KERAMATI
Hamed
Mask aligner (Karl Suss)
SHEN
Zhiyuan
HE
Jinhua
LU
Jingyu
HO
Kar Kiat
ZHANG
Xiaomin
Mask aligner (Karl Suss)
LU
Jingyu
Mask aligner (Karl Suss)
HO Kar Kiat Mask aligner (OAI) Mask aligner (OAI) Mask aligner (OAI) Mask aligner (OAI)
HO Kar Kiat RIE (Technics) RIE (Technics) RIE (Technics) RIE (Technics)
HOONG Sin Poh RIE Deep (STS) Maintenance
HOONG
Sin Poh 		forMOHAMMAD
Olfatnia(1)
HOONG
Sin Poh 		forMOHAMMAD
Olfatnia(1)
 RIE Deep (STS) RIE Deep (STS) RIE Deep (STS)
Nordin Bin Abdul Kassim SEM SEM
ZHAN
zhaoyao
SEM SEM
Person in charge Book
Machine		 Monday, 23 November 2009 Tuesday, 24 November 2009 Book
Machine		 Wednesday, 25 November 2009 Thursday, 26 November 2009 Book
Machine		 Friday, 27 November 2009 Saturday, 28 November 2009 Book
Machine		 Sunday, 29 November 2009 Monday, 30 November 2009
09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 1112 13 14 151617 18 19 20 09 10 11 12 13 14 15 1617 18 19 20
PEK Soo Siong Sputter Magnetron Sputter Magnetron Sputter Magnetron Sputter Magnetron
Nordin Bin Abdul Kassim Stress measurement (Tencor) Stress measurement (Tencor) Stress measurement (Tencor) Stress measurement (Tencor)
HO Kar Kiat Wafer bonder
HO
Kar Kiat 		forMOHAMMAD
Olfatnia(1)
 Wafer bonder Wafer bonder Wafer bonder

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This webpage has been updated on Tuesday, August 25, 2009.